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| General Goals |
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| The basic objective of the MESDIE project is to develop and model new chip sets
and dedicated modules (HDP/HDI) for different applications with regard to harsh
physical coupling aspects and problems of system integration of selected demonstrators
(application specific demonstrator) to evaluate the project results in terms of product
relevance and specific demonstrators to test the developed during the project runtime
EMC/HDP/RF solutions as found typically in telecommunication, automotive, consumer
and multimedia application. Design techniques resulting from the project will enable the
modeling and simulation of these aspects followed by an analysis at user level. |
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Concept of design improvement
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